Good day, as im developing an FC based on STM32h743 package UFBGA or TFBGA , i need info a about the vias supported size for the funout in a 4 layer board as 6 layer it not avaiable for now.
Regards
Hi there! You can find our 4 Layer design rules here:
We support via sizes down to 0.45 mm when using a 0.25 mm drill.
Good day, doing the design I’ve test the following vias diameter 0.25 and via hole 0.15, seems a good option for fun out the stm32h743iik6, the point its the minimum trace width… setting using the aisler minimum to 0.12 seem to thick…while using 0.10 seems a good size. Suggestions are well appreciated
Waiting for a kind response
We don’t support vias that small. A short neck down to 100µm is possible but may decrease the yield.
Are the other package types of this MCU like the BGAs with higher pitch of TQFP an option?
so…loonking the datasheet of stm32h743 they offer also 0.8mm pitch,0.50 mm pitch,0.8 mm pitch.
Do you support 0.45 with drill of 0.25?
Yes, we support 0.45 mm diameter vias with 0.25 mm drills as highlighted in our design rules which I have linked in an earlier post in this thread.
Hello , so doing some trials on the design I saw that the vias size are generating some DRC errors so for now seems impossible fan out BGA… so for now capabilities are limited
OMG, this entire process is far more involved and extensive than in 2016.
Can there be a simpler alternative? It took at least an hour to finally order a project. Kept getting re-routed, etc. There are so many options now, which is good but probably unnecessary the majority of the time. In 2018 I left went to a Chinese company, uploaded a Gerber and that was it!