Hi,
I have some boards, manufactured by Aisler, with PCB stackup 4 layer detailed as follow:
- 4 Copper layers, 1.6mm
- ENIG Surface Finish,
- 35um Copper Outer Layers
- PCB Color Green
- Silkscreen White
The base material is FR4 TG 150, and I need to solder these boards in a reflow oven.
According to material details, what is the maximum reflow temperature that can be used to avoid persistent damages as burned PCB or any other problem?
Any suggested reflow profile would be of great help as well.
I know that FR4 TG 150, from 150°C transitions from solid to more pliable state.
Thanks,
g.