Good day, im developing a new FC and i would like make it in a 4 layer stackup, but due some requirements i need an advice about the layers.
Some sensors are shared on SPI bus, usart and pwm.
Usually im working using SIG-GND-GND-SIG, but due the density i need know if SIG/GND/SIG/SIG can be problematic or there is an alternative??
Waiting for a kind response
Hi David,
From a PCB manufacturing standpoint, it is not super critical how you use the various layers.
(The amount of copper does somewhat play a role in the selection of the prepreg and amount of resin, but I won’t go into details here.)
From an EMC perspective, a SIG/GND/SIG/SIG will inherently perform worse as you are not providing a good return path. If possible, try and have ground floods on both inner layers. When you need to run traces on them, avoid disrupting the return flow of traces on the outer layers, and stitch the layers together. Eg. don’t run traces perpendicularly.
Ultimately the boards will most likely function with your suggested Stackup, but if EMC compliance is a concern for you, I would suggest reaching out to Würth Elektronik or Smanders, who can connect you with an expert on the topic.
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