6-Layer HD PCB Stackup

Stackup for 6-Layer Boards

We use Panasonic Prepreg 1080 Type R-1551(W) (58.9 KB), Peters coatings and Elga Copper foil.

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Nice, but much higher priority for me would be 1mm thickness in 2 or 4 layers. I would even prefer 6 layers in 1mm because 6 layers are mainly needed for fine-pitch BGAs and then miniaturization is the goal. PCB thickness contributes significantly to that.

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I think this answer fits perfect to the Feature Request category. (👥 Feature Requests - AISLER Creative Community)


Hi, it is already there…

Argh… Only 2 links per post allowed. Here is the 3rd one:


There is an impedance table for 4L boards here:

I’ve found that table to be a useful reference. It might be helpful to provide a similar table for 6L boards to help verify calculations, even if it doesn’t cover all possibilities.


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Thank you for providing an overview for the stackup :slight_smile: . Are there any values for the Dissipation Factors of the dielectrics available?

Also I don’t really understand how to read the Epsilon R values from the datasheet. The values of the datasheet linked seem to be different from the ones you specify. Is it due to the different thickness (0,5mm) used in the datasheet?

I searched for another document for the same materials: Halogen Free R-1566(W_WN) Datasheet 2022 (panasonic.com)
The values for the respective strengths seem to fit more to the values you provided.

Hi, i loaded your suggested 6-layer stackup File, but when uploading via your outputjob Aisler is showing only a 4 Layer Count. What i am missing here. Thanks and keep up the good work!

Hi Lucas, could you check if the corresponding Gerber layers are enabled on the OutJob? Chances are, that we missed to enable these by default :face_with_open_eyes_and_hand_over_mouth:

Hi Patrick, i checked the Gerber settings. And you were right. Two layers missed a check! Now it is working. Thanks

Great news! Would you mind sharing the updated OutJob with us? :face_with_peeking_eye:

Sure… Within the push-to-aisler.Outjob rightclick at the Gerber Files (Fabrication Outputs) → Configure. In the Option Menu check the corresponding layers !

Hello there,
will Aisler always use exacly the layer stack depicted above? In other words: Are the thicknesses and substrate materials guaranteed? This is a requriement for RF projects where the RF ground is not located on layer 2.

Best regards!

Hi @holzi ,

yes, the stackup will be manufactured as shown above using the same materials. This is guaranteed.


How about via stack up? Micro(Blind)Vias (or even burid via, i.e. 2-3, 4-5, 2 … 5) already an option or still only full stack vias?

Currently only full stack vias are supported.

I this the nominal stickup? Unless I messed up my maths, this gives a total board thickness of just over 1.4mm.
Assuming the usual 10% thickness tolerances I could have a thickness just under 1.6mm or slightly above 1.3mm, Is that right?