2 Layer 1.6mm 70µm ENIG
Last Updated: 04/12/2025
Imperial measures are rounded from metric measurements.
Minimum Copper Features
Minimum Copper Spacing / Clearance
| min. spacing copper / copper | 175 µm / 7 mil | |||
| min. spacing NPTH / copper | 250 μm / 10 mil | |||
| min. spacing NPTH slot <1.8 mm / copper | 300 μm / 12 mil | |||
| min. spacing NPTH slot >= 1.8 mm / copper | 300 μm / 12 mil | |||
| min. copper to edge clearance | 300 μm / 12 mil |
Surface Finish
We use Electroless Nickel Immersion Gold (ENIG) this surface finish offers good surface planarity and high oxidation resistance.
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PCB Dimension
We accept PCBs within these dimensions for our prototype service, contact our support if your design does not meet these criteria.
Plated Through Hole (PTH)
All drills with a diameter larger than 0.45 mm are categorized as plated through hole for component mounting, we will enlarge the drill diameter to compensate for the copper plating thickness to ensure that components can be mounted more easily.
| min. PTH drill size | 0.5 mm / 0.02 in | |||
| max. PTH drill size | 5.6 mm / 0.22 in | |||
| min. PTH annular ring | 300 μm / 12 mil |
Vias
All drills with a diameter up to 0.45 mm are categorized as via drill and will not be subjected to any adjustments by us.
| min. via drill | 0.25 mm / 10 mil | |||
| max. via drill | 0.45 mm / 20 mil | |||
| min. via annular ring | 175 μm / 7 mil |
Non Plated Through Hole (NPTH)
Minimum Drill Spacing
NPTH Slots
NPTHs Slots that are smaller than 1.8 mm are nibbled. This is a time-intensive process, so we reserve the right to limit the use of nibble slots in a design. Diameters above 1.8 mm will be milled and are thus preferred.
| preferred NPTH slot diameter | >= 1.8 mm / 0.07 in | |||
| min. NPTH slot diameter | 0.8 mm / 0.032 in | |||
| max. NPTH slot diameter |
PTH Slots
| min. PTH slot diameter | 0.7 mm / 0.028 in | |||
| max. PTH slot diameter | 2.6 mm / 0.11 in | |||
| min. PTH slot annular ring | 300 µm / 12 mil |
Silkscreen
The smallest supported width is 150 µm / 6 mil, all silkscreen features with a width less of that will be adjusted. Silkscreen printed on pads is not supported, we use openings in the soldermask as reference to cut away / remove the silkscreen in the affected area. Do not use the silkscreen to produce large fillings, designs which cover more than 25% per PCB side will be rejected.
| min. silkscreen text height | 800µm / 32 mil | |||
| min. spacing silkscreen / pad | 125 µm / 5 mil | |||
| silkscreen on pad | not supported | |||
| max. Silkscreen | 25% of Board size |
Soldermask
| soldermask dam between pads | recommended but not required | |||
| min. soldermask dam | 100µm / 4 mil | |||
| suggested soldermask expansion | 50 µm / 2 mil |
Castellated Edges
Castellated edges are manufactured free of charge, please refer to our documentation on how you can set them up.
| castellated edges | Supported |
Additional Notes
- Buried, blind, micro or tented vias are not supported.
- User-defined subpanels are not allowed, see also here.
- Pressfit components are currently not supported.

































