Our goal is to provide the optimal product for you. That’s why we classify your PCB as “Simple” or “Complex”, depending on the complexity of your design. Take a look at the table below to see which features make a board complex or simple. A board is classified as complex as soon as it has at least one complex feature. Each class is compatible with specific products that can be selected and ordered at the end of the ordering process. Please make sure to select Beautiful Boards HD (Surface Finish: ENIG) if your copper design includes complex line widths and/or spacings.
feature
Simple
Complex
min. drill diameter
≥ 0.3 mm
≥ 0.2 mm
no. of layers
2
4
smallest necessary milling tool for cutouts
2.4 mm
1.6 mm
contains plated slots / elongated holes
contains castellated holes
min. trace width/spacing
200 µm/150 µm
125 µm/125 µm
Specifications
The following design rules should be respected if you want to manufacture yor PCBs with us.
take extra care that you design your inner layers with positive polarity
t, u, v: drill distances refer to the tool diameter, please see here
user defined subpanels are not allowed, see also here
soldermask openings should have the size of the underlying pad, as the openings are automatically enlarged by us
Please also note that these rules are the bare minimum that we support. If you can leave some safety margins in your design, the PCBs will be more likely to work the way you intended them to.
Please also note that these rules are the bare minimum that we support. If you can leave some safety margins in your design, the PCBs will be more likely to work the way you intended them to.
is this mostly intended for traces and clearances or also for via sizes?
I am designing a PCB and using the smallest possible vias would be really beneficial (0.6/0.2)
is it save to use lots of these vias (around 30) or would it be better to go for (0.7/0.3)?
In principle, this statement also refers to the dimension of vias. But if small vias (0.6/0.2) help you to realise your specific layout and thus bring you added value, then there is nothing to say against using them!
Welcome to the community!
I guess you mean the clearance/spacing values for simple? We included a little security margin and set them to 175 µm – if you need to, you can reduce those values to 150 µm in the .dru-file according to the table above.
In general, we try to keep the design rule files up to date. However, in case of doubt, the values listed above apply.
I would like to mention again that these values are minimum values. If your layout allows it, it does certainly make sense to design widths and distances with some safety margin.
I am trying to route the LP8550, which have DSBGA 25 Footprint with 0.5 mm Pitch. Using this design-rules (4 Layer complex) it is impossible to route it.
If I kept the drill size 0.2 mm and tried to achieve outer-diameter from 0.35 mm (see Photo), is it possible to manufacture it?
If I kept the drill size 0.2 mm and tried to achieve outer-diameter from 0.35 mm (see Photo), is it possible to manufacture it?
For BGAs with a pitch of 0.5 mm, we are at the limit of our technical capabilities.
Your suggestion to reduce the pad diameter to 0.35 mm - as I understand you - is not sufficient for a safe through-hole plating. Another problem with a 0.5 mm pitch is the minimum drill spacing (please see also here)
One more question, are Ball-Pads supported?
Do you mean via-in-pad? In principle, you can use via-in-pads in your layout and have them manufactured by us. However, please note that we do not fill the borehole. This allows solder to flow through the hole during assembly. When using our assembly service, via-in-pads are therefore not permitted.
I think that I and all Others will appreciate an article just about BGAs
do i understand it correctly, that the minimum annular ring of a via has to be 0,2mm?
Correct!
I would like to use vias with 0,2mm hole and 0,1mm ring. Would that be possible?
As these vias do not comply with our design rules, they are manufactured at your own risk.
Would this match your rules?
The vias (0.2 mm drill diam, 0.6 mm pad diameter) are correctly dimensioned. Please note that sufficient distance is maintained between Via-Pad and other copper structures!
Wenn I upload the file (like shown in the second picture) to your service, no error is displayed.
That is correct. It is your responsibility to upload a compliant design!
When processing your data, we remove the silkscreen print on and in the immediate vicinity of openings in the soldermask (= most pads). You can see the result in our Board Viewer - only the silkscreen that is displayed there will be printed.
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