2 Layer 1.6mm 70µm HASL Design Rules

2 Layer 1.6mm 70µm HASL

Last Updated: 04/12/2025
Imperial measures are rounded from metric measurements.

Minimum Copper Features

Description Capability
min. tracewidth 225 µm / 9 mil
min. SMD pad size 225 µm / 9 mil

Minimum Copper Spacing / Clearance

min. spacing copper / copper 225 µm / 9 mil
min. spacing NPTH / copper 250 μm / 10 mil
min. spacing NPTH slot <1.8 mm / copper 300 μm / 12 mil
min. spacing NPTH slot >= 1.8 mm / copper 300 μm / 12 mil
min. copper to edge clearance 300 μm / 12 mil

Surface Finish

We use lead-free Hot Air Surface Leveling (HASL) for this product portfolio, this surface finish is low cost and suitable for many applications.
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surface finish HASL
HASL thickness 1 µm - 40µm

PCB Dimension

We accept PCBs within these dimensions for our prototype service, contact our support if your design does not meet these criteria.

min. dimension >10 mm / >0.4 in
max. size 500 x 500 mm / 19.68 in x 19.68

Plated Through Hole (PTH)

All drills with a diameter larger than 0.45 mm are categorized as plated through hole for component mounting, we will enlarge the drill diameter to compensate for the copper plating thickness to ensure that components can be mounted more easily.

min. PTH drill size 0.5 mm / 0.02 in
max. PTH drill size 5.6 mm / 0.22 in
300 μm / 12 mil

Vias

For economic manufacturing of simpler boards, we may increase the drill size up to a diameter of 0.45 mm. An annular ring of 175 µm is required, and the absolute minimum to compensate for the larger drill. Wherever possible, a minimal annular ring of 200 µm must be used.

min. via drill 0.3 mm / 12 mil
max. via drill 0.45 mm / 18 mil
min. via annular ring 200 μm / 8 mil

Non Plated Through Hole (NPTH)

Minimum Drill Spacing

min. drill spacing 300 μm / 12 mil

NPTH Slots

NPTHs Slots that are smaller than 1.8 mm are nibbled. This is a time-intensive process, so we reserve the right to limit the use of nibble slots in a design. Diameters above 1.8 mm will be milled and are thus preferred.

preferred NPTH slot diameter >= 1.8 mm / 0.07 in
min. NPTH slot diameter 0.8 mm / 0.032 in
max. NPTH slot diameter :infinity: No restriction

PTH Slots

min. PTH slot diameter 0.7 mm / 0.028 in
max. PTH slot diameter 2.6 mm / 0.11 in
min. PTH slot annular ring 300 µm / 12 mil

Silkscreen

The smallest supported width is 150 µm / 6 mil, all silkscreen features with a width less of that will be adjusted. Silkscreen printed on pads is not supported, we use openings in the soldermask as reference to cut away / remove the silkscreen in the affected area. Do not use the silkscreen to produce large fillings, designs which cover more than 25% per PCB side will be rejected.

min. silkscreen text height 800µm / 32 mil
min. spacing silkscreen / pad 125 µm / 5 mil
silkscreen on pad not supported
max. Silkscreen 25% of Board size

Soldermask

soldermask dam between pads required for HASL
min. soldermask dam 100µm / 4 mil
suggested soldermask expansion 50 µm / 2 mil

Castellated Edges

Castellated edges are not supported with HASL surface finish, please order your design as 2 Layer 1.6mm ENIG board if you use them.

Additional Notes

  • Buried, blind, micro or tented vias are not supported
  • User-defined subpanels are not allowed, see also here
  • Pressfit components are currently not supported.
  • Countersunk and counterbore are not supported.